Michael Pecht Editor & Author

Chung-Shing Lee is a research economist at the Heiden Associates, Inc., a Washington economics and management consulting firm specializing in the application of economic and statistical analysis to business strategy and public policy. Mr. Lee graduated from National Taiwan University and the University of Maryland at College Park. He is also studying toward a doctorate degree in Engineering Management at the School of Engineering and Applied Science, the George Washington University. He has more than seven years of industrial consulting experience, including computer and telecommunication industries. His major research interests are in the areas of Asian technology development, strategy and technology management, industrial economics, and strategic use of information technology. Michael Pecht is a Professor and Director of the CALCE Electronic Packaging Research Center (EPRC) at the University of Maryland. The CALCE EPRC is sponsored by over 40 organizations, and conducts research to support the development of competitive electronic products in timely manner. Dr. Pecht has a BS in Acoustics, a MS in Electrical Engineering and a MS and PhD in Engineering Mechanics from the University of Wisconsin. He is a Professional Engineer, an IEEE Fellow, an ASME Fellow and a Westinghouse Fellow. He is the chief editor of both the IEEE Transaction on Reliability and Microelectronics and Reliability, an associate editor of the International Microelectronics Journal, and on the advisory board of the Journal o f Electronics Manufacturing. He serves on the board of advisors for various companies and consults for the U.S. government, providing expertise in strategic planning in the area of electronics.