Quality Conformance and Qualification of Microelectronic Packages and Interconnects
4 contributors - Paperback
£148.95
Michael G. Pecht, PHD , has an MS in electrical engineering and a PhD in engineering mechanics. He is a Professional Engineer, an IEEE Fellow, an ASME Fellow, and an IMAPS Fellow. He was editor of the IEEE Transactions on Reliability for eight years. He is now editor for Microelectronics Reliability. He is a Chair Professor and the Director of the CALCE Electronic Products and Systems Center at the University of Maryland. He has written more than 20 books on electronic products development and reliability, and over 400 technical articles. In 2008, he was awarded the highest reliability honor, the IEEE Reliability Society's Lifetime Achievement Award.