Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium

EPITS 2022, 14-15 September, Langkawi, Malaysia

Mohd Arif Anuar Mohd Salleh editor Mohd Izrul Izwan Ramli editor Dewi Suriyani Che Halin editor Kamrosni Abdul Razak editor

Format:Hardback

Publisher:Springer Verlag, Singapore

Published:3rd Jul '23

Should be back in stock very soon

Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium cover

This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th  and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.

ISBN: 9789811992667

Dimensions: unknown

Weight: unknown

875 pages

2023 ed.