3D Microelectronic Packaging
From Architectures to Applications
Yan Li editor Deepak Goyal editor
Format:Paperback
Publisher:Springer Verlag, Singapore
Published:24th Nov '21
Should be back in stock very soon
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
ISBN: 9789811570926
Dimensions: unknown
Weight: unknown
622 pages
2nd ed. 2021