Two Component Injecton Moulding For Moulded Interconnect Devices

Aminul Islam author

Format:Paperback

Publisher:LAP Lambert Academic Publishing

Published:26th May '10

Currently unavailable, and unfortunately no date known when it will be back

Two Component Injecton Moulding For Moulded Interconnect Devices cover

This paperback, "Two Component Injecton Moulding For Moulded Interconnect Devices" from Aminul Islam, was published 26th May 2010 by LAP Lambert Academic Publishing.

ISBN: 9783838365831

Dimensions: 229mm x 152mm x 12mm

Weight: 318g

212 pages