Capacitively Coupled Chip-To-Chip Interconnect Design
Format:Paperback
Publisher:VDM Verlag
Published:6th May '10
Currently unavailable, and unfortunately no date known when it will be back
This paperback, "Capacitively Coupled Chip-To-Chip Interconnect Design" from Lei Luo, was published 6th May 2010 by VDM Verlag.
ISBN: 9783639253368
Dimensions: 229mm x 152mm x 8mm
Weight: 213g
140 pages