Capacitively Coupled Chip-To-Chip Interconnect Design

Lei Luo author

Format:Paperback

Publisher:VDM Verlag

Published:6th May '10

Currently unavailable, and unfortunately no date known when it will be back

Capacitively Coupled Chip-To-Chip Interconnect Design cover

This paperback, "Capacitively Coupled Chip-To-Chip Interconnect Design" from Lei Luo, was published 6th May 2010 by VDM Verlag.

ISBN: 9783639253368

Dimensions: 229mm x 152mm x 8mm

Weight: 213g

140 pages