Copper Interconnect for Silicon ULSI Seedless Copper Electrochemical Deposition for ULSI - Interconnect
Format:Paperback
Publisher:VDM Verlag
Published:23rd Dec '08
Currently unavailable, and unfortunately no date known when it will be back
This paperback, "Copper Interconnect for Silicon ULSI Seedless Copper Electrochemical Deposition for ULSI - Interconnect" from Sunjung Kim, was published 23rd December 2008 by VDM Verlag.
ISBN: 9783639111309
Dimensions: 229mm x 152mm x 8mm
Weight: 200g
144 pages