Testing of Interposer-Based 2.5D Integrated Circuits
Krishnendu Chakrabarty author Ran Wang author
Format:Paperback
Publisher:Springer International Publishing AG
Published:9th May '18
Currently unavailable, and unfortunately no date known when it will be back
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.
ISBN: 9783319854618
Dimensions: unknown
Weight: 3051g
182 pages
Softcover reprint of the original 1st ed. 2017