Materials for Advanced Packaging
Daniel Lu editor CP Wong editor
Format:Paperback
Publisher:Springer International Publishing AG
Published:8th Jun '18
Currently unavailable, and unfortunately no date known when it will be back
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
ISBN: 9783319832098
Dimensions: unknown
Weight: unknown
969 pages
Softcover reprint of the original 2nd ed. 2017