Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

A thorough review of the failure of electronic packaging, discussing theoretical aspects, experimental results, and modeling techniques

Failure of electronic packaging: Effects of temperature, moisture and mechanical driving forces provides a thorough review of this important field of research.Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.