Advanced Metallization Conference 2005 (AMC 2005): Volume 21
Sywert H Brongersma editor Thomas C Taylor editor Manabu Tsujimura editor Kazuya Masu editor
Format:Hardback
Publisher:Materials Research Society
Published:1st Jan '06
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The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Technical leaders from around the world gather here to discuss developments in the areas of interconnect performance, advanced metallization, low-dielectric constant materials, barrier metallization, atomic layer deposition, advanced packaging and vertical integration. Both current state-of-the-art and ongoing challenges associated with multilevel interconnect are addressed. Included are papers on the latest developments in the integration of low-dielectric constant materials with copper-based metallization, and advances in the understanding of means by which process- or stress-induced damage can be mitigated and reliability of the interconnect system improved. Additional contributions discuss the design, development and modeling of advanced on-chip and multichip interconnect architectures and real-world implementation of optimized designs, materials and processes for production of leading-edge microelectronic devices.
ISBN: 9781558998650
Dimensions: 235mm x 160mm x 44mm
Weight: 1160g
782 pages