Advanced Metallization Conference 2001 (AMC 2001): Volume 17
Takayuki Ohba editor Andrew J McKerrow editor Yosi Sacham-Diamand editor Shigeaki Zaima editor
Format:Hardback
Publisher:Materials Research Society
Published:1st Jan '02
Currently unavailable, and unfortunately no date known when it will be back
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Leading-edge advanced metallization schemes, as applied to VLSI interconnects, include the introduction of novel metals systems and novel dielectric materials. Technological advances highlighted at AMC 2001 include the latest developments in integrating copper metallization with low-dielectric constant materials, and evaluations of the reliability of such interconnects. Recently, in both industry and academia there has been increased interest in basic research as applied to the field of vertical integration. Since the problems that affect vertical integration are similar to those of VLSI interconnects, it is natural to include the topic here. In fact, it is anticipated that cross fertilization between the fields of VLSI metallization and vertical interconnect will yield a viable technical solution to the problem of multichip integration. This book offers a comprehensive look at the current state of the art of VLSI interconnects. Topics include: process integration; vertical integration and advanced packaging; copper metallization; low-K dielectrics technology; modeling; reliability; barriers; atomic-layer epitaxy and other technologies; and CMP and automation.
ISBN: 9781558996700
Dimensions: 235mm x 159mm x 42mm
Weight: 1110g
719 pages