Practical Guide to the Packaging of Electronics
Thermal and Mechanical Design and Analysis, Third Edition
Format:Hardback
Publisher:Taylor & Francis Inc
Published:11th Jul '16
Currently unavailable, and unfortunately no date known when it will be back
This hardback is available in another edition too:
- Paperback£45.99(9781032097824)
Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems
A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the basics needed to design a new system or troubleshoot a current one. Updated to reflect recent developments in the field, this latest edition adds two new chapters on acoustic and reliability fundamentals, and contains more information on electrical failures and causes. It also includes tools for understanding heat transfer, shock, and vibration.
Additionally, the author:
- Addresses various cross-discipline issues in the design of electromechanical products
- Provides a solid foundation for heat transfer, vibration, and life expectancy calculations
- Identifies reliability issues and concerns
- Develops the ability to conduct a more thorough analysis for the final design
- Includes design tips and guidelines for each aspect of electronics packaging
Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition
explains the mechanical and thermal/fluid aspects of electronic product design and offers a basic understanding of electronics packaging design issues. Defining the material in-depth, it also describes system design guidelines and identifies reliability concerns for practitioners in mechanical, – electrical or quality engineering."This book is intended for a hands-on engineer who needs back-of-the-envelope tools to develop design parameters and develop a means to conduct sanity checks. The true value of the book, however, is to raise the awareness of the design team on various aspects of the design that leads to developing a more reliable product."
—James Feine, President, USI Ultrasonic, Houston, Texas, USA
ISBN: 9781498753951
Dimensions: unknown
Weight: 657g
376 pages
3rd edition