Packaging of High Power Semiconductor Lasers
Xingsheng Liu author Wei Zhao author Lingling Xiong author Hui Liu author
Format:Hardback
Publisher:Springer-Verlag New York Inc.
Published:15th Jul '14
Currently unavailable, and unfortunately no date known when it will be back
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
ISBN: 9781461492627
Dimensions: unknown
Weight: 842g
402 pages
2015 ed.