Advances in CMP Polishing Technologies

Ioan D Marinescu editor Toshiro Doi editor Syuhei Kurokawa editor

Format:Hardback

Publisher:William Andrew Publishing

Published:20th Dec '11

Currently unavailable, and unfortunately no date known when it will be back

Advances in CMP Polishing Technologies cover

In a field where commercial confidentiality has limited the spread of knowledge, this book opens up emerging technologies and new applications to a wide audience of engineers in the semiconductor industry and beyond

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R&D accessible to the wider engineering community.CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field – making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology – the science of friction, wear and lubrication – the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries.

ISBN: 9781437778595

Dimensions: unknown

Weight: 550g

328 pages