Recent Trends in VLSI and Semiconductor Packaging

T Vasudeva Reddy editor KMadhava Rao editor

Format:Paperback

Publisher:Taylor & Francis Ltd

Publishing:6th May '25

£49.99

This title is due to be published on 6th May, and will be despatched as soon as possible.

This paperback is available in another edition too:

Recent Trends in VLSI and Semiconductor Packaging cover

The International conference on Semiconductor Materials packaging, AI&ML, Reconfigurable VLSI architectures for IoT, future Communication Technologies (“SMART-2024”) aimed to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields. “SMART-2024” seeked to foster collaboration, innovation, and knowledge dissemination by bringing together experts and stakeholders from diverse backgrounds to address key issues and explore new research directions. The conference targeted a diverse audience including researchers, academicians, scientists, engineers, technologists, industry professionals, students, policymakers, and other stakeholders interested in VLSI, IoT, AI-ML, communication systems, semiconductor packaging, hetero architecture devices, and Nano materials.

ISBN: 9781041017875

Dimensions: unknown

Weight: unknown

648 pages