Integrated Passive Component Technology
Richard K Ulrich editor Leonard W Schaper editor
Format:Hardback
Publisher:John Wiley & Sons Inc
Published:11th Jul '03
Currently unavailable, and unfortunately no date known when it will be back
- This is a thorough survey of the state-of-the-art in Integrated Passive Component Technology.
- Describes the processes available for creating integrated passives, measuring their properties, and applying them.
- Brings reader up to date in a fast-moving technology.
- Enables reader to implement the technology into a manufacturing environment.
- Covers existing and potential technologies for various substrate systems such as FR4, ceramic, and HDI.
- Describes applications favorable to integrated passives and the economic tradeoffs associated with their implementation.
"…a comprehensive look at the reasons and current challenges…[of integrating] passive devices into board or IC…just the right dose of the math to explain the physics and theory behind the technology." (IEEE Circuits & Devices Magazine, Jan/Feb 2005)
"...an interesting and useful book; I wholeheartedly recommend it."(Circuit World, Vol.30, No. 2003)
ISBN: 9780471244318
Dimensions: 245mm x 162mm x 24mm
Weight: 683g
379 pages